hardware-thermal

This module contains the STMicroelectronics android.hardware.thermal binary source code.

It is part of the STMicroelectronics delivery for Android.

Description

This module implements android.hardware.thermal HIDL version 2. Please see the Android delivery release notes for more details.

Documentation

• The [release notes][] provide information on the release. [release notes]: https://wiki.st.com/stm32mpu-ecosystem-v5/wiki/STM32_MPU_OpenSTDroid_release_note_-_v5.1.0

Dependencies

This module can't be used alone. It is part of the STMicroelectronics delivery for Android. To be able to use it the device.mk must have the following packages:

PRODUCT_PACKAGES += \
    android.hardware.thermal@2.0-service.stm32mpu

Containing

This directory contains the sources and associated Android makefile to generate the thermal binary.

License

This module is distributed under the Apache License, Version 2.0 found in the LICENSE file.